i-CON VARIO4

Highlights

Desoldering tips for diverse applications

Thin-walled and slim designs for work on densely populated boards

 

Standard designs with internal diameters ranging from 0.6 mm up to 2.4 mm

 

Thick-walled designs, e. g. to suck residual solder off BGA pads

Strong vacuum for especially safe desoldering processes

 

Very easy to change residual solder container, suitable for continuous operation